High-Temperature Reliability: Thermal Cycling Test

Thermo-mechanical stresses caused by CTE-mismatch is considered detrimental to the reliability of electronic packages. The thermal cycling test can be used to determine the ability of circuit components and interconnects to withstand these stresses. This video shows the setup for thermal cycling test in CPES. Our recent results of the reliability test on direct-bond-copper (DBC) substrates are also briefly introduced. To learn more please visit www.cpes.vt.edu.


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